wavesolder {faraway}

Defects in a wave soldering process

Description

Components are attached to an electronic circuit card assembly by a wave-soldering process. The soldering process involves baking and preheating the circuit card and then passing it through a solder wave by conveyor. Defect arise during the process. Design is 2^{7-3} with 3 replicates.

Format

A data frame with 16 observations on the following 10 variables.

y1

Number of defects in the first replicate

y2

Number of defects in the second replicate

y3

Number of defects in the third replicate

prebake

prebake condition - a factor with levels 1 2

flux

flux density - a factor with levels 1 2

speed

conveyor speed - a factor with levels 1 2

preheat

preheat condition - a factor with levels 1 2

cooling

cooling time - a factor with levels 1 2

agitator

ultrasonic solder agitator - a factor with levels 1 2

temp

solder temperature - facctor with levels 1 2

Source

L. Condra (1993) Reliability improvement with design of experiments. Marcel Dekker, NY.

References

M. Hamada and J. Nelder (1997) Generalized linear models for quality improvement experiments, Journal of Quality Technology, 29, 292-304